Siemens 解决方案可助力半导体公司实现创新，打造面向未来的晶圆厂，以高精度与高效率完成生产，同时为全球半导体生态系统构建一个更智能、更具韧性且可持续发展的未来。
要应对算力最大化挑战，同时满足节点微缩需求，这意味着半导体行业必须突破物理与工程的极限。在此过程中，还需兼顾业务运营的盈利能力、效率与质量，推动可持续发展。
Empower your team with electronic design automation (EDA) tools and digital twin capabilities that keep pace with the rapid changes and ever-increasing complexity of silicon-enabled, software-defined, AI-powered products.
Deliver and integrate cutting-edge equipment with digital twin technology, integrated automation and data-driven optimization by enabling smarter design, predictive maintenance and resilient operations with the highest yield.
Secure your semiconductor operations. Implement robust cybersecurity and data management to protect high-value IP and critical OT systems against cyber threats, ensuring operational integrity and continuous production.
Design and build your chips with confidence with an end-to-end lifecycle management solution that connects design, engineering, manufacturing execution and supply chain solutions to bring high-quality products to market faster.
Increase overall equipment effectiveness (OEE) and profitability with secure IT/OT and AI analytics. Optimize energy and resources via smart and integrated facility, electrification, grid and building management.
Adopt strategic training solutions for software, automation, low-code apps and AI digital twins to boost productivity and close skill gaps. Maximize EDA IP reuse and knowledge capture to accelerate innovation.
Conquer IC and advanced package design challenges and streamline development with cutting-edge solutions. Address integrated chip design complexity and manufacturing scalability while improving yield and lowering costs.
Enhance your operations and leverage automation engineering solutions to build and deliver the next generation of semiconductor equipment and services, quickly and at scale.
Design and build future-proof semiconductor fabs by evolving from lean manufacturing to smart manufacturing with a wide range of digitally integrated design, execution and automation solutions.
Every semiconductor lifecycle is managed seamlessly—enhancing stakeholder collaboration and ensuring security, traceability and quality—while accelerating NPIs and time to market.
Building the fabs of tomorrow demands safe, secure, reliable, robust and future-ready infrastructure. Discover our integrated solutions that support the priorities and objectives of your semiconductor manufacturing infrastructure.
从设计可持续产品，到推动可持续制造，再到加速打造可持续供应链，我们的解决方案可帮助您在整个数字化转型旅程中逐步完善运营。我们还致力于让先进技术触手可及，并将面向制造的设计融入主流，助您创造更可持续的未来。
以下是我们处于行业领先地位的一些客户：
Siemens 提供广泛的产品、解决方案和服务，但我们业务模式的核心是与值得信赖的合作伙伴紧密协作。我们的合作伙伴进一步丰富和增强了我们的服务能力，确保您始终获得可靠的解决方案。
让我们携手推进制造业前行，为整个生态体系赋能，在各行业实现增材制造的设计、生产和应用。
