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ENDÜSTRİYEL SINIF EDA YZ

Siemens EDA Yapay Zekâ

arı iletken ve PCB tasarımını hızlandıran, endüstriyel ölçekte ve amaca yönelik yapay zekâ çözümleriyle
EDA’nın geleceğine öncülük ediyoruz.

Basın bültenini okuyun

Why industrial-grade EDA AI matters

The semiconductor industry is facing a convergence of pressures: designs of unprecedented complexity rooted in advanced packaging, heterogeneous integration and hardware-software convergence, a talent crisis with the industry on track to need over one million additional skilled workers globally by 2030 and surging demand fueled by AI infrastructure build-out. Our response to these challenges is a clear, three-pillar AI strategy built around speed, productivity and confidence.

Faster engines

By harnessing GPU acceleration, in-tool machine learning and reinforcement learning, we are dramatically reducing simulation and verification runtimes across the full design cycle, delivering speed improvements of up to 1000x.

Smarter execution

Our purpose-built agentic AI autonomously orchestrates multi-tool workflows from high-level synthesis through physical verification and board design, delivering productivity gains of 10–50x.

Trusted outcomes

By continuously validating agent decisions against our physics-based EDA engines, we deliver self-verifying AI workflows where every agent decision is validated against proven engineering tools.

Introducing Fuse EDA AI Agent

Orchestrate complex multi-tool workflows to boost productivity and increase design quality. ​

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Fuse EDA AI system

Purpose-built for semiconductor and PCB design environments, this innovative solution delivers secure generative and agentic AI capabilities with unparalleled customization flexibility, seamlessly integrating across the entire EDA workflow.

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Explore Siemens EDA AI portfolio

Siemens EDA AI portfolio enhances productivity, accelerates innovation and speeds time-to-market.

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Aprisa - 10x productivity boost, 3x compute-time efficiency, and 10% better PPA

Fuse EDA AI - Purpose-built EDA AI system for advanced generative and agentic AI

Questa - 3x reduction in verification coverage closure time and 10x reduction in the verification of design changes

Solido - 2-1000X+ faster simulation, variation-aware design and verification, characterization and IP validation

Tessent - 10x faster architecture implementation and 5x shorter test time for DFT

Veloce - 50% reduction in RTL compile time and 100% increase in throughput