Solve complex NVH issues at any development stage
Transfer path analysis (TPA) is a technique for understanding and optimizing a system's noise, vibration, and harshness (NVH) behavior. It pinpoints critical paths from vibration sources to the receiver structure, enabling effective performance improvements. While traditional TPA relied on physical assembly prototypes, shorter development cycles and the need for earlier decisions have driven its evolution. Component-based TPA (C-TPA) is a modern, modular approach that enables NVH data acquisition at the component level and supports virtual assessment of full-assembly performance without a complete physical prototype.
This methodology enhances data reusability, accelerates design exploration at any development stage, and simplifies the integration of physical test data with CAE simulation results — while fostering smoother collaboration between OEMs and suppliers. Simcenter™ provides a comprehensive TPA toolchain supporting both traditional and advanced C-TPA methods, with a guided, integrated workflow that automates data collection and analysis. Seamless CAE integration removes barriers between physical testing and virtual simulation, empowering engineers to make faster, more confident decisions.
