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PCB DESIGN BEST PRACTICES

Design for advanced manufacturing technologies

Design for advanced manufacturing technologies

The utilization of advanced manufacturing technologies can get you to market faster. There are several advanced manufacturing technologies for PCBs to consider including, bond wires, embedded passives, embedded actives, rigid flex PCB design and High-Density Interconnect (HDI).

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Rigid-flex PCB design

Ensure first-pass success with a rigid-flex design process, including unique stack-up styles, PCB bend-areas, region rules such as vias, trace, and plane types, and design visualization in an integrated 2D/3D environment.

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High-Density Interconnect (HDI)

Reduce costs and minimize risk as your pin pitch gets tighter. Meet the growing need for more complex designs in smaller form factors. Efficiently interconnect array packages with high numbers of I/Os.