New capabilities and features
Watch this short introduction overview video compilation.
What's new in Xpedition IC Packaging VX.2.14
This release delivers capabilities targeting heterogenous integration and the prototyping, planning, design and verification of next-generation 2.5/3D package assemblies. Discover the new features and capabilities now available.
Fact sheet
Xpedition IC Packaging VX.2.14
Read about the key new capabilities and features in VX.2.14.
Download the release
Note: Siemens customers should refer to the release highlights for detailed information regarding all new features and enhancements.