What's new in Xpedition IC Packaging VX.2.13
Xpedition IC Packaging VX.2.13 delivers capabilities targeting heterogeneous integration and the prototyping, planning, design and verification of next-generation 2.5/3D package assemblies. Discover the new features and capabilities of the VX.2.13 release.
Overview of Xpedition IC Packaging VX.2.13
- Optimized planning workflows and reduce development time.
- Minimized errors: accurate visualizations and import functionalities prevent costly revisions.
- Streamlined iteration: hierarchical planning and reusable arrays expedite design complexity.
- Enhanced signal integrity: automated features perfect electrical and manufacturing results.
- Performance boost: improved handling of larger designs.
Key capabilities snapshot
Leverage
Leverage custom user layers to create mechanical items for early analysis, such as thermal
Import
Import conductive plan shapes to support planning tradeoffs and better electrical analysis accuracy
Device prototyping
Use smart regions to enable rapid hierarchical device prototyping of complex ASICs and chiplets
Re-use
Re-use complex via array structures across designs
Improved editing performance
Improved authoring/editing performance on large designs to reduce the number of cycles
Improved manufacturability
Improved manufacturability and electrical signal behavior with teardrops on pads at route T-junctions
Xpedition IC Packaging VX.2.13 fact sheet
Learn about the key capabilities in the Xpedition IC Packaging VX.2.13 release in this fact sheet.
Download the release
Note: The following is a condensed summary of the release highlights. Siemens customers should refer to the Release Highlights on Support Center for detailed information regarding all new features and enhancements.