Chiplet IP on TSMC 3DFabric
Alphawave Semi tapes out its cutting edge UCIe™ 3D IP on the advanced TSMC (SoIC-X) technology in the 3DFabric platform, marking a significant evolution in the company’s chiplet integration capabilities!
Our IP Partner, Alphawave Semi, is an industry leader in high-speed connectivity IP with 112G and 224G SERDES chip designs across multiple nodes and fabs - enabling faster data transmission and greater reliability with lower power for designs in 7nm, 6nm, 5nm and beyond.
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