Integrated system-level planning and prototyping​

Construction and visualization of system-level logical connectivity of multi-die, multi-component and multi-substrate IC package designs.

Visualization of the system as a floorplan-in-floorplan view with connectivity. Rules-based connectivity optimization can be run by signal, bus or interface. Breakout routing can be easily included to drive system optimization.

Driven by Xpedition Substrate Integrator, 3DSTACK uniquely identifies geometries per layer per die in the assembly, allowing accurate LVS assembly checking and overall verification.

Xpedition Substrate Integrator provides a graphical, rapid virtual prototyping environment tuned for the exploration and integration of multiple heterogeneous ICs/chiplets & interposers into High Density Advanced Packages (HDAP).

Learn about system-level connectivity management and verification of 3D IC heterogeneous assemblies in this white paper.

Read this white paper to learn more about the two key challenges electronic systems engineers face when deploying a system-level netlist driven LVS workflow for 3D IC assembly in advanced package designs.