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Accelerating Intelligence 

Siemens at Supercomputing 2026

Date: November 17–19, 2026 
Location: McCormick Place, Chicago 
Booth: 2811 

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Discover the physical world behind AI

AI is driving unprecedented demand for compute, but scaling AI takes more than computing power. It requires new ways to design, operate and optimize the physical infrastructure behind it. 

At Supercomputing 2026, discover how Siemens brings together engineering, simulation, automation and intelligence to address the challenges of increasing compute density, power, cooling, performance and reliability. 

Experience what it takes to scale AI

Visit the Siemens booth for an interactive experience exploring the connected decisions behind AI infrastructure from increasing compute demand and system design to workload optimization, power and cooling, and reliability.



What you'll explore:

Design for increasing compute demand

See how increasing compute density impacts system and infrastructure design.


Optimize AI and HPC workloads

Explore how workload decisions impact performance, efficiency and resources.


Manage power and cooling

See how infrastructure can respond as compute demand changes.


Improve reliability

Explore how intelligence can help anticipate issues and keep critical workloads running.


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Meet with Siemens at SC26

Make the most of your time at SC26 with a conversation focused on your priorities. We'll bring together the right people from Siemens based on the challenges and opportunities most relevant to your organization.