OSAT Alliance Program

Amkor's Mission

The mission of Amkor Technology® is to be a trusted provider of reliable assembly and test manufacturing services and innovative solutions to semiconductor and microelectronics companies around the world. Now a strategic manufacturing partner for more than 300 of the world’s leading semiconductor companies, foundries, and electronics OEMs, Amkor's close collaboration with customers and supply chain partners has led to advanced technology that significantly reduces cycle time.​

The partnership of Amkor Technology and Siemens

Partnering with Siemens, Amkor developed, tested, and certified the SmartPackage™ Package Assembly Design Kit (PADK), the industry’s first ADK to support Siemens High Density Advanced Packaging (HDAP) design process and tools. Together, Amkor’s award-winning High-Density Fan Out (HDFO) process and Siemens industry-leading technologies can be used to speed the accurate design and verification of the advanced packages required for Internet-of-Things (IoT), automotive, high-speed communications, computing, and artificial intelligence (AI) applications.

ASE is the world's largest OSAT. In collaboration with Siemens, they now offer Assembly Planning and 3D LVS verification of their FOPoP, FOCoS, FOCoS-Bridge, and 2.5/3D technologies

Deca Technologies offerings:

Advanced IC packaging is critical to industries where high-performance is mandatory, such as fabless, systems, defense and aerospace, OSATs and foundries.

Fully molded fan-out wafer-level package

Deca’s M-Series™, is a rugged, fully molded fan-out wafer-level package (FOWLP) that provides exceptional reliability, performance, and quality; all in a miniaturized format. M-Series FX is designed into most of the leading smartphones around the globe.

Adaptive patterning

Adaptive Patterning® (AP) extends beyond traditional Design for Manufacturing (DFM), its unique Design-During-Manufacturing (DDM) adapts each design in real-time to accommodate natural process variation producing perfectly aligned interconnects every time on every device.

Technology provider

Through technology transfer and license agreements with ASE, SkyWater, and nepes DECA's M-Series and AP technologies are available to the industry as emerging standards for advanced fan-out and related technologies.

The partnership of Deca Technologies and Siemens

Deca developed with Siemens, ASE, & SkyWater an Adaptive Patterning workflow which encompasses co-design planning, physical implementation through to substrate and package assembly verification. Siemens tuned its Innovator 3D IC and Calibre technologies to support Deca’s requirements.

Mosaic Microsystems is a leader in microelectronics and photonics packaging with a primary focus on enabling the use of thin glass substrates with low loss, low roughness and ability to scale to large area formats, providing solutions for interposers and other packaging substrates.

NHanced will employ Siemens EDA technologies to develop ADKs for their silicon interposer-based technology which targets the Industrial, medical, military and scientific industry segments.