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EDA AI IN INDUSTRIEQUALITÄT

Siemens EDA AI

Wir leisten Pionierarbeit in der Zukunft von EDA durch industrietaugliche, speziell entwickelte KI-Lösungen, die Halbleiter beschleunigen
und PCB-Design.

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Why industrial-grade EDA AI matters

The semiconductor industry is facing a convergence of pressures: designs of unprecedented complexity rooted in advanced packaging, heterogeneous integration and hardware-software convergence, a talent crisis with the industry on track to need over one million additional skilled workers globally by 2030 and surging demand fueled by AI infrastructure build-out. Our response to these challenges is a clear, three-pillar AI strategy built around speed, productivity and confidence.

Faster engines

By harnessing GPU acceleration, in-tool machine learning and reinforcement learning, we are dramatically reducing simulation and verification runtimes across the full design cycle, delivering speed improvements of up to 1000x.

Smarter execution

Our purpose-built agentic AI autonomously orchestrates multi-tool workflows from high-level synthesis through physical verification and board design, delivering productivity gains of 10–50x.

Trusted outcomes

By continuously validating agent decisions against our physics-based EDA engines, we deliver self-verifying AI workflows where every agent decision is validated against proven engineering tools.

Introducing Fuse EDA AI Agent

Orchestrate complex multi-tool workflows to boost productivity and increase design quality. ​

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Fuse EDA AI system

Purpose-built for semiconductor and PCB design environments, this innovative solution delivers secure generative and agentic AI capabilities with unparalleled customization flexibility, seamlessly integrating across the entire EDA workflow.

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Explore Siemens EDA AI portfolio

Siemens EDA AI portfolio enhances productivity, accelerates innovation and speeds time-to-market.

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Aprisa - 10x productivity boost, 3x compute-time efficiency, and 10% better PPA

Fuse EDA AI - Purpose-built EDA AI system for advanced generative and agentic AI

Questa - 3x reduction in verification coverage closure time and 10x reduction in the verification of design changes

Solido - 2-1000X+ faster simulation, variation-aware design and verification, characterization and IP validation

Tessent - 10x faster architecture implementation and 5x shorter test time for DFT

Veloce - 50% reduction in RTL compile time and 100% increase in throughput