Comprehensive tool flow for HPC innovation
Our HPC solution spans IC design, verification, manufacturing and test to advanced packaging, 3D IC and PCB design and manufacturing. We provide an unmatched advantage in HPC system innovation using software, mechanical, PLM and enterprise technologies from the Siemens Xcelerator portfolio.
- Catapult HLS - 透過高階合成技術,更快地為您的 HPC SoC 找到合適的架構
- PowerPro - 透過早期功耗估算與卓越的優化技術,實現更低功耗的 RTL 設計
- Precision RTL - 具備高可靠性優化功能、不受供應商限制的 FPGA 合成方案
- 3D IC 解決方案 - 運用完整的 3D IC 工作流程,開發超越摩爾定律的創新技術
- Tessent DFT - 插入測試模組設計以提升測試效率
- 嵌入式分析 - 整合分析 IP,以監控現場的 IC 與 HPC 系統
- Questa Advanced Verification - Design, simulate and verify IC logic with a complete portfolio
- Veloce Strato emulation - Verify and validate entire SoC functionality, test software in the context of the system
- Veloce proFPGA prototyping - Get a jump on software development with an intuitive prototyping system
- Symphony - Run accurate simulations between the analog and digital domains
- Solido Characterization Suite - Ensure silicon library suitability for HPC applications
- Aprisa - Leverage state-of-the-art physical implementation flow to quickly achieve power, performance and area goals
- mPower - Reach optimal power integrity goals for analog, digital and mixed-signal blocks faster
- Calibre xAct - Accurately capture the parasitics of the most advanced IC processes
- Calibre design solutions - Leverage the industry's most trusted portfolio for silicon signoff
- Xpedition Enterprise - State-of-the-art enterprise solution for PCB systems
- PADS Professional - Entire flow for HPC PCB systems design
- HyperLynx - Industry-leading signal integrity analysis
- Valor - PCB system manufacturing
- Supplyframe - Digital marketplace that brings electronics value chain to designer desktops
- Siemens SimCenter - Unmatched electronic to mechanical thermal analysis
