Thermal testing

Unlike thermocouples, infrared imaging, or x-ray inspection, Simcenter Micred solutions use a nondestructive, JEDEC 51-compliant electrical method that reveals the complete internal thermal structure — not just surface temperature or geometry — with one-click results. Test data also connects directly to Simcenter Flotherm and Simcenter FLOEFD, enabling automated model calibration to over 99 percent accuracy. The result: customers report up to 78 percent time and cost reduction designing ECUs and a 30 percent increase in heat dissipation capacity and lifetime for power electronics modules.

Traditional methods like x-ray or invasive probing can damage the device under test or destroy it entirely, limiting how much you can learn. Nondestructive testing lets you evaluate the same component repeatedly, track degradation over its lifetime, and reuse test samples — saving cost while producing more reliable, repeatable data.

JEDEC 51 is an industry-standard electrical test method for measuring thermal resistance and junction temperature in semiconductor devices. Compliance ensures your thermal metrics are measured consistently and are comparable across manufacturers, making it easier to specify components, validate datasheets, and meet customer or industry qualification requirements.

A structure function converts a thermal transient measurement into a visual profile of thermal resistance versus thermal capacitance, layer by layer, from junction to ambient. It reveals the internal heat flow path of a component, making it possible to pinpoint exactly where degradation, imperfections, or design weaknesses exist.

Simulation predicts thermal behavior using computational models, while testing measures actual thermal performance on real hardware. The two work best together: test data validates and calibrates simulation models, improving their accuracy, while simulation lets you explore design alternatives quickly without building a physical prototype for every option.

Yes. Simcenter Micred solutions support a wide range of semiconductor types and materials, including silicon-carbide (SiC) MOSFETs and gallium-nitride (GaN) HEMTs, in addition to traditional diodes, MOSFETs, IGBTs, and digital ICs — helping manufacturers characterize next-generation, high-power-density designs with confidence.

Active power cycling repeatedly stresses a component through switching and temperature transients to simulate real-world operating conditions over an accelerated timeframe. Combined with thermal degradation monitoring, it verifies predicted lifetime, isolates failure mechanisms, and identifies which design interfaces need improvement — without waiting for components to fail unexpectedly.

Yes. Automated, high-throughput thermal testing can be integrated directly into manufacturing lines for end-of-line (EoL) quality assurance. It verifies thermal performance on every unit, sorts output into quality bins, and supports standard communication protocols — helping manufacturers catch defects before products reach customers.

Thermal testing delivers the most value when it spans the entire product lifecycle, not just a single checkpoint. Use it early in design to calibrate simulation models and predict lifetime, during pre-production to qualify reliability through active power cycling, and at end-of-line to catch manufacturing defects before products reach customers. Starting early and testing continuously — rather than only after a failure occurs — reduces redesign costs and helps ensure consistent quality at scale.

Yes. Simcenter Micred hardware supports modular options — including boosters, cold plates, and controlled-environment chambers — to adapt to your existing test setup, and its software integrates directly with Simcenter Flotherm and FLOEFD for simulation correlation. On the production side, systems can be integrated with robotic handlers and support standard communication protocols like SECS/GEM, OPC UA, and Modbus, making it straightforward to fit into established manufacturing lines rather than requiring a separate, siloed process.