Access the wide range of presentations delivered at the International Test Conference (ITC) by Siemens leaders, Tessent experts, customers and partners. Learn about our industry leading solutions for design for test (DFT), IC test, yield learning and in-life monitoring and analytics.
Siemens is proud to be a diamond supporter of the International Test Conference 2024. You can watch the recordings of the key diamond presentations below.
Ankur Gupta, Senior Vice President and General Manager of Digital Design Creation Platform at Siemens EDA opens the Diamond Event to speak to the ITC crowd on “Transformative Technologies for a Sustainable Future”
Anurag Jindal, Head of DFX Group at Ericsson presents on the “Faster and More Effective Flow Enabled by an Integrated Platform”
Vishal Agarwal, Senior Director at Nvidia speaks to the ITC 2024 crowd about test challenges in the AI Era
Dan Trock, Principal Engineer at Amazon Web Services, presents on “Deterministic In-fleet Scan Test in AWS Cloud”
Watching presentations in the Tessent theater is a tradition on the ITC exhibit floor, where our customers and partners present their experiences with Tessent technologies, reference flows and collaboration projects. View the most recent presentations from ITC 2024 below.
Don't miss this opportunity to look back and to learn from Tessent experts DFT presentations over recent years at ITC.
Darshan Kobla, Senior Director at Microsoft leading Test Strategy across all product segments, recommends keeping DFT efforts simple and predictable when designs are complex.
Nilanjan Mukherjee, Sr. Director of Engineering, Tessent, Siemens EDA, explains how early DFT verification reduces time to market.
Ankur Gupta, VP/GM, Tessent, Siemens EDA, concludes the ITC Diamond event with a presentation on how Siemens EDA enables a smarter future faster.
Don't miss this opportunity to look back and to learn from Tessent experts DFT presentations over recent years at ITC.
Ankur Gupta, Vice President and GM, Tessent, Siemens EDA, introduces DFT to In-Life monitoring for electronic systems at ITC 2022.
Dan Trock, Principal Engineer at Amazon Web Services, presents on reducing design effort, test time & power with SSN in AWS Custom Silicon.
Janusz Rajski, Vice President of Research and Development, Tessent, Siemens EDA, presents on structural deterministic test in the silicon lifecycle.
Vidya Neerkundar, Product Manager, Tessent, Siemens EDA introduces Advancements in DFT automation for 2.5D / 3D IC era.
Breakthrough yield barriers with Siemens & PDF Solutions introduced by Siemens & Thomas Zanon, Engagement Director, PDF Solutions.
Don't miss this opportunity to look back and to learn from Tessent experts DFT presentations over recent years at ITC.
Dave Dehnert, Principal Engineer, Intel, discusses SSN implementation on a large multi-die SOC.
Wu Yang, Technical & Foundry Programs Manager for Tessent at Siemens EDA, presents an EDA perspective on 3D IC test, including IEEE 1838 and 3D stack test methodology.
Janusz Rajski, Vice President of Research and Development for Tessent at Siemens EDA, presents work on the current state of pattern compaction technology.
Lee Harrison, Automotive Test Solutions Manager for Tessent at Siemens EDA, explores the issues of security challenges in IC test.
Lee Harrison, Automotive Test Solutions Manager for Tessent at Siemens EDA, discusses using the tools of Silicon Lifecycle Management (SLM) to monitor the aging effects on automotive electronics.
Srinu Alampally, Master Engineer at Broadcom, presents enhancing test on 3GHz designs with SSN.
Plug & Play DFT solutions to high performance computing (HPC)/AI presented on behalf of Dongkwan Han from Samsung Foundry.
