Xpedition Enterprise

Establishing a digitally integrated solution across multiple domains reduces manual intervention, fosters collaboration and improves transparency across disciplines.

With a digitally integrated and optimized multi-domain environment, all engineering teams, including IC, IC packaging, FPGA, and PCB design within electronics, as well as mechanical and software, can optimize the costs associated with a project, accelerate design time, manage data integrity and improve the quality of results. The best practices that can enable a digitally integrated and optimized multi-domain environment include:

• ECAD/MCAD collaboration
• Design/manufacturing collaboration
• Library and design data management
• Secure remote collaboration

In general, the PCB design process is the same no matter the tool, the team, the company or the culture. The differentiator is the manner of execution, where engineering productivity and efficiency play a significant role. This enables you to:

• Predictably and reliably manage complex and high-capacity designs
• Utilize advanced interactive and automated design support to accelerate routine tasks
• Design correct-by-construction with a constraint-driven process
• Implement concurrent team design-driven cycle-time reduction

The best practices that can enable engineering productivity and efficiency include:

• Design automation
• Analog/digital/RF
• Concurrent design
• Design reuse
• Constraint driven design
• Advanced design

While product and design complexity increases, associated tools and process complexity are also rising. By integrating verification throughout PCB design – starting very early, long before physical prototypes – engineering teams can smooth the entire electronic systems design process and increase design quality through digital-prototype driven, shift-left verification and cross-domain modeling.

Shift-left verification in the design flow eliminates the specialist bottleneck using automated, integrated tools. Cost and time are saved by finding problems early, during design, minimizing design iterations and manufacturing respins. The best practices include:

• Schematic analysis
• Thermal analysis
• Signal integrity analysis
• Power integrity analysis
• Analog mixed-signal analysis
• Design for manufacturability analysis

From system requirements to implementation and manufacturing, a model-based systems engineering approach allows team members to view the entire system (electronic, electrical, mechanical and software) and model pieces, defining and optimizing interconnectivity and traceability from one domain to the other.

The best practices that can enable system-level model-based engineering include:

• Multi-board
• Electrical/electronic
• FPGA/PCB optimization
• IC/Package/PCB

Electronic systems design companies have always depended on a value chain of suppliers and manufacturing services to bring successful products to market. Connecting the demand for a product with the supply of its necessary parts has never been more complex than it is today. The answer is to design for supply chain resilience.

The best practices that can enable supply chain resilience include:

• BOM validation
• Best-known part availability
• Validation of alternates