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Innovator3D IC
Delivers the fastest and most predictable path for planning and heterogeneous integration of ASICs and chiplets using the latest semiconductor packaging 2.5D and 3D technology platforms and substrates.
Advanced IC Packaging solutions
Bringing IC package and IC design together with tools that operate in both the IC and packaging domains, the advanced IC packaging flow offers a complete solution for rapid prototyping/planning of heterogeneously integrated chiplet assemblies, physical design, verification, signoff and modeling.
IC packaging design and verification
Monolithic scaling limitations drive the growth of 2.5/3D multi-chiplet, heterogeneous integration that enables PPA targets to be met. Our integrated flow addresses IC package prototyping challenges to signoff for FOWLP, 2.5/3D IC and other emerging integration technologies.
IC Packaging Design tools provide a complete design solution for creating complex, multi-die homogeneous or heterogeneous devices using FOWLP, 2.5/3D or system-in-package (SiP) modules, as well as IC package assembly prototyping, planning, co-design and substrate layout implementation.
Analysis of die/package signal and power integrity, EM coupling and thermal conditions. Fast, easy-to-use and accurate, these tools ensure that engineering intent is fully achieved.
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Signal integrity analysis
Ensure that you are getting designed right the first time, avoiding costly overdesign and saving test cycles with HyperLynx Signal Integrity.
Physical verification and signoff that meet foundry and outsource substrate assembly and test (OSAT) requirements ensure performance and time-to-market goals are met.
3D IC Podcast
Take a deep dive into the 3D IC podcast series to learn how three-dimensional integrated circuits take less space and deliver higher performance.
