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What's new in Xpedition IC Packaging VX.2.13

Xpedition IC Packaging VX.2.13 delivers capabilities targeting heterogeneous integration
and the prototyping, planning, design and verification of next-generation 2.5/3D package assemblies. Discover the new features and capabilities of the VX.2.13 release.

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Key new capabilities

Watch this short overview of the key new capabilities

Fact sheet

Xpedition IC Packaging VX.2.13 fact sheet

Learn about the key capabilities in the Xpedition IC Packaging VX.2.13 release in this fact sheet.

ic packaging, an image of a chip in the center of a computer motherboard highlighted in light blue.

Download the release

Note: The following is a condensed summary of the release highlights. Siemens customers should refer to the Release Highlights on Support Center for detailed information regarding all new features and enhancements.

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