Advanced semiconductor packaging

30-day trials

Explore the differentiated capabilities of Innovator3D IC and Calibre technologies in these self-contained cloud hosted virtual laboratories.

High density advanced packaging (HDAP) product trials

Calibre 3DSTACK trial

Get started with Calibre 3DSTACK today

Find out how the Calibre 3DSTACK environment enables you to perform physical verification on your multi-die package to fully check connectivity and critical DRC violations.

Innovator3D IC Layout

Migrate Cadence APD and SiP data

Find out how to migrate Cadence ADP and SiP data to Innovator3D IC Layout with ease by signing up for our free trial today!

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Innovator3D IC Layout

Explore advanced IC Package substrate design

Explore advanced IC Package substrate design with Innovator3D IC Layout and experience the fastest path to implementation.

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Innovator3D IC (i3DI) and (i3DL)

Semiconductor bump planning of die and chiplets

Learn how to quickly create die/chiplet bump plans with signal assignments.

The image shows a person standing in front of a large screen displaying a colorful abstract design.

Innovator3D IC (i3DI) and (i3DL)

Design a silicon interposer

Learn how to design a silicon interposer containing a system-on-chip (SoC) connected to high-bandwidth memories (HBM) using Innovator3D IC Integrator (i3DI) and Innovator3D IC Layout (i3DL).

A screenshot of a software interface displaying a predictive thermal analysis with various graphs and data points.

CALIBRE 3DTHERMAL TRIAL

Unlock early thermal insight with Calibre 3DThermal

Learn to perform early predictive thermal analysis on advanced semiconductor packages. Discover how Calibre 3DThermal prevents downstream implementation headaches, optimizing designs for enhanced performance and reliability.

Deepen your semiconductor packaging knowledge

Customer Support

Siemens offers world-class customer support for all IC Packaging products. Get in touch with us today.

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IC Packaging blog

Keep up with the latest news and highlights for IC Packaging software.

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Contact us

Speak with an IC Packaging expert and get answers to all of your IC Packaging software questions.