Goglio SpA, a packaging leader since 1850, addresses the challenges of continuous production through digitalization. The need for maximum reliability and fault prevention drove the company to evolve its MIND platform. Together with Siemens, Goglio has transcended traditional maintenance, transforming every machine into an intelligent ecosystem powered by machine learning and edge computing.
Turning Complexity into Digital Value
Tangible Results for a Data-Driven Industry
Boosting plant productivity
By analyzing data at the source, it is possible to maximize performance while reducing waste and optimizing machine work cycles.
Preventing downtime with AI
Integrating machine learning algorithms allows for the detection of anomalies before they turn into failures, ensuring operational continuity.
Scaling innovation with Industrial Edge
A flexible framework that allows for the centralized and secure management and update of digital functionalities on a global scale.
Goglio: machine learning and artificial intelligence

Elevating MIND platform functionalities
In partnership with Siemens, Goglio integrated Industrial Edge technology to enhance its digital service offering. Using technologies like the IPC 427 Edge and Siemens Marketplace apps, the company merged mechanical expertise with advanced AI logic. This approach allows for the management of massive data volumes, ensuring immediate responses and top-tier cybersecurity.
Constant monitoring of critical components
Thanks to SINAMICS S120 and the TRCDATA Technology Function, Goglio's packaging lines can monitor the most critical machine parts with unprecedented precision. Granular analysis enables the creation of a reliable predictive model, turning raw data into actionable insights for maintenance teams, drastically reducing emergency interventions and associated costs.


Sustainability through digital efficiency
For Goglio and Siemens, digitalization is the engine of sustainability. Optimizing performance means reducing energy consumption and material waste across all phases. Siemens’ architecture allows Goglio to anticipate market needs, supporting the development of packaging solutions with leaner and smarter production processes.
The integration of Siemens Edge technology has allowed us to elevate the functionality of our service offering on the MIND platform. All this was possible by merging our already stable Industrial IoT platform with machine learning and AI logic made available by the apps on the Siemens Marketplace.
