ทำไม Improve layer adhesion in large format AM?

DEMEX solves the problem of insufficient layer adhesion in large format Additive Manufacturing. The system uses light generated by high-power LEDs to heat the substrate locally. The light is focused to a spot in front of the nozzle. The optimum temperature for layer bonding is ensured at the interface without risking stability. Due to visible, broad-spectrum light, DEMEX avoids laser safety regulations.
Parts printed with DEMEX show isotropic properties for tensile strength as the weak interface between layers is eliminated. The technology can be used with any thermoplastic polymer and is relevant for demanding applications, where PEEK, PEI, PESU, or other high-performance polymers are processed.
DEMEX is retrofittable on any new or existing large format 3D printer and integrates using standard communication interfaces.
LEAMs product on Siemens Industrial Edge expands value share from Siemens Numerical Control to Edge Computing and quality assurance software in future LFAM machines.