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What's new in Xpedition IC Packaging VX.2.14

This release delivers capabilities targeting heterogenous integration and the prototyping, planning, design and verification of next-generation 2.5/3D package assemblies. Discover the new features and capabilities now available.

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Key new capabilities and features

Watch this short introduction overview video compilation.

Fact sheet

Xpedition IC Packaging Whats New fact sheet

Read about the key new capabilities and features in VX.2.14

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Note: The following is a condensed summary of the release highlights. Siemens customers should refer to the Release Highlights on Support Center for detailed information regarding all new features and enhancements.