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Close up of a computer chip.
Semiconductor packaging best practices​

Integrated system-level planning and prototyping​

Multi chiplet/ASIC packages with heterogeneous integration need early assembly floorplanning if power, performance, area and cost targets are to be achieved.

IC package assembly planning & co-optimization

An integrated IC package planning and prototyping solution enables architects and designers to construct and optimize complete IC package assemblies for power, performance, area and cost and deliver a well-qualified prototype for implementation.

SEMICONDUCTOR PACKAGING VIDEO

Hierarchical device planning

This video shows how hierarchical device planning can construct a chiplet/die which is then exported as a device and floorplan replicated on a silicon substrate. 

Integrated system-level planning resources

Learn more about integrated system-level IC package planning and prototyping from system connectivity management, cross-domain interconnect optimization and 3D assembly verification.

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Connectivity management
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System connectivity management

Construction and visualization of system-level logical connectivity of multi-die, multi-component and multi-substrate IC package designs.

Cross-domain interconnect image
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Cross-domain interconnect optimization

Visualization of the system as a floorplan-in-floorplan view with connectivity. Rules-based connectivity optimization can be run by signal, bus or interface. Breakout routing can be easily included to drive system optimization.

Calibre 3DStack
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Calibre 3DSTACK

Driven by Xpedition Substrate Integrator, 3DSTACK uniquely identifies geometries per layer per die in the assembly, allowing accurate LVS assembly checking and overall verification.