
3Dblox example data files
Free download of a self-extracting archive of 3Dblox syntax files that represent a multi-die Fan-Out Wafer-Level Package (FOWLP).
This standard defines a modular, hierarchical syntax and rules for describing components and their connectivity in 2.5D/3D advanced packaging, including chiplets, interposers, and substrates. Enhancing the 3Dblox language, it provides high-level descriptions of component size, orientation, interface, thickness, interconnect regions, structures, and other integration-critical properties. Designed for chiplet makers, 2.5D/3D packagers, and end users, this language streamlines component representation for advanced packaging. Learn more.

In this demo you will see how Innovator3D IC drives Calibre 3DSTACK using 3Dblox. Watch as files are imported and used in our tools