Develop and manage the most intricate device assemblies, including 3D ICs, side-by-side configurations, and multi-height stacks, with full support for embedded active and passive devices like interposers.

Design and verify complex SiP modules within a comprehensive 3D environment, utilizing simultaneous 2D/3D editing and real-time DRC to detect and avoid 3D-related issues. Implement sophisticated real-time wire bonding for multi-die stacks, ensuring your advanced packaging designs are robust and precise.

Boost your design efficiency and shorten overall design time through a modern, AI-infused user experience that predicts and recommends operations. Streamline rapid design construction with a layout-driven methodology and on-the-fly device and net creation.

Evaluate design feasibility quickly with integrated electrical, thermal, and stress analysis, and collaborate seamlessly with real-time multi-user concurrent team design, visualizing all activity across networks and geographies.

Implement high-bandwidth memory (HBM) interfaces rapidly with automatic channel step/repeat and off-pitch pin compensation. Plan and route critical data paths efficiently using patented automated routing technology.

Ensure signal integrity with built-in automatic net tuning and automatic shielding for differential pairs and single-ended nets, delivering optimal electrical performance for your high-speed designs.

Reduce signoff effort and avoid costly tapeout ECOs by performing powerful in-design geometry-based DRC throughout the design process, utilizing common rules and custom rule creation. Prepare your designs for flawless fabrication with dynamic metal fill capabilities, including multi-pass degassing, metal balancing, and dummy fill insertion, all while maintaining interactive performance.

Verify every level of your 3D package assembly through comprehensive DRC/LVS signoff with direct Calibre 3DSTACK integration, ensuring your design precisely matches manufacturing outputs.